Simulation of power delivery networks with Joule heating effects for 3D integration

Electronics System Integration Technology Conference, ESTC 2010 - Proceedings

Volumn , Issue , 2010, Pages

  Xie, Jianyong ^a   Swaminathan, Madhavan ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; ACCURATE ESTIMATION; CONVECTION EFFECTS; DC VOLTAGE; ELECTRICAL RESISTIVITY; FINITE-VOLUME FORMULATION; HEAT EQUATION; IR DROP; JOULE HEATING EFFECT; NATURAL CONVECTION EFFECTS; POWER DELIVERY NETWORK; SIMULATION RESULT; SYSTEM LEVELS; TEMPERATURE DEPENDENT; TEMPERATURE EFFECTS; THERMAL EQUATIONS; THERMAL SIMULATIONS; VOLTAGE DISTRIBUTION; VOLTAGE DROP;

DC POWER TRANSMISSION; DROPS; ELECTRIC CONDUCTIVITY; EQUATIONS OF STATE; HEAT CONVECTION; HEATING; JOULE HEATING; TEMPERATURE;

COMPUTER SIMULATION;

EID: 78651346002     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2010.5642927     Document Type: Conference Paper

References (6)

1. International Technology Roadmap for Semiconductors (ITRS), 2006 update.
2. Swaminathan, M., Chung, D., Grivet-Talocia, S., Bharath, K., Laddha, V., Xie, J., "Designing and Modeling for Power Integrity," IEEE Trans. on Electromagnetic Compatibility, vol. 53, no. 2 (2010).
3. Shakeri, K., Meindl, J. D., "Compact Physical IR-Drop Models for Chip/package Co-design of Gigascale Integration (GSI)," IEEE Trans. Electron Devices, vol. 52, no. 6 (2005), pp. 1087-1096.
4. Xie, J., Chung, D., Swaminathan, M., Mcallister, M., Deutsch, A., Jiang, L., Rubin, B. J, "Electrical-thermal Co-analysis for Power Delivery Networks in 3D System Integration," IEEE International Conference on 3D System Integration (3DIC), Sept. 2009, pp. 1-4.
5. Xie, J., Chung, D., Swaminathan, M., Mcallister, M., Deutsch, A., Jiang, L., Rubin, B. J, "Effect of System Components on Electrical and Thermal Characteristics for Power Delivery Networks in 3D System Integration," 18th conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Oct. 2009, pp. 113-116.
6. Ozisik, M. N., Finite Difference Methods in Heat Transfer, CRC Press (1994), pp. 190-191.