The package bandwidth limitation of high speed broadband products

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 1457-1462

  Wen, Y ^a  

^a ON SEMICONDUCTOR   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BANDWIDTH; BONDING; BROADBAND NETWORKS; ELECTRIC WIRE; FLIP CHIP DEVICES;

BANDWIDTH LIMITATION; HIGH SPEED BROADBAND PRODUCTS; PLASTIC BALL GRID ARRAY; QUAD FLAT PACK NO LEAD;

ELECTRONICS PACKAGING;

EID: 0034822881     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. Three-dimensional interconnect analysis using partial element equivalent circuits
2. Inductance calculations in a complex integrated circuit environment
3. An experimental technique for full package inductance matrix characterization
4. Capacitance characterization of surface mount electronic packages
5. Over 20 Ghz microwave frequency model of fine pitch ball grid array bonding