Biocompatibility assessment of advanced wafer-level based chip encapsulation

Electronics System Integration Technology Conference, ESTC 2010 - Proceedings

Volumn , Issue , 2010, Pages

  Dy, Eric ^a   Vos, Rita ^a   Rip, Jens ^a   La Manna, Antonio ^a   Op De Beeck, Maaike ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

BI-DIRECTIONAL; CMOS COMPATIBLE; CO-CULTURES; CULTURE MEDIUM; CYTOTOXIC; DEAD CELLS; DIE ENCAPSULATION; EXTRACELLULAR ENVIRONMENTS; IMPLANTABLE DEVICES; IMPLANTABLE MICROSYSTEMS; IN-VITRO; MEDICAL DEVICES; NEONATAL RAT CARDIOMYOCYTES; PHYSIOLOGICAL TEMPERATURE; WAFER LEVEL; WAFER LEVEL PACKAGING;

BIOCOMPATIBILITY; BIOMEDICAL ENGINEERING; BIOSENSORS; CELL CULTURE; DIFFUSION BARRIERS; FILM GROWTH; IMPLANTS (SURGICAL); LEACHING; MICROELECTRODES; SILICON CARBIDE; SILICON NITRIDE;

ELECTRONICS PACKAGING;

EID: 78651316554     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2010.5642972     Document Type: Conference Paper

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