An IC-centric biocompatible chip encapsulation fabrication process

Electronics System Integration Technology Conference, ESTC 2010 - Proceedings

Volumn , Issue , 2010, Pages

  Op De Beeck, Maaike ^a   La Manna, Antonio ^a   Buisson, Thibault ^a   Dy, Eric ^a   Velenis, Dimitrios ^a   Axisa, Fabrice ^b   Soussan, Philippe ^a   Van Hoof, Chris ^a  

^a IMEC   (Belgium)

^b GHENT UNIVERSITY   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

EMBEDDING PROCESS; ENCAPSULATION LAYER; FABRICATION PROCESS; HERMETICITY; IMPLANTABLE DEVICES; MEDICAL IMPLANTS; METALLIZATIONS; PROCESS FLOWS; STEP COVERAGE; WAFER LEVEL;

DIES; IMPLANTS (SURGICAL); INDOOR AIR POLLUTION;

ELECTRONICS PACKAGING;

EID: 78651329965     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2010.5642917     Document Type: Conference Paper

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