Extremely superhydrophobic surfaces with micro- and nanostructures fabricated by copper catalytic etching

Langmuir

Volumn 27, Issue 2, 2011, Pages 809-814

  Lee, Jung Pil ^a   Choi, Sinho ^a   Park, Soojin ^a  

^a Ulsan National Institute of Science and Technology   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CATALYTIC ETCHING; CHEMICAL-ETCHING PROCESS; CHEMICALLY MODIFIED; CU NANOPARTICLES; ELECTROLESS CU PLATING; ETCHING CONDITION; HYDROPHOBIC PROPERTIES; LOW SURFACE ENERGY; MICRO AND NANOSTRUCTURES; SILICON SURFACES; SIMPLE METHOD; SUPER-HYDROPHOBIC SURFACES; SUPERHYDROPHOBIC BEHAVIOR; THIN LAYERS; WATER CONTACT ANGLE;

CONTACT ANGLE; ETCHING; NANOPARTICLES; SURFACE CHEMISTRY; SURFACE PROPERTIES; SURFACE ROUGHNESS;

HYDROPHOBICITY;

COPPER; NANOMATERIAL; SILICON;

ARTICLE; CATALYSIS; CHEMICAL PHENOMENA; CHEMISTRY; PARTICLE SIZE; SURFACE PROPERTY;

CATALYSIS; COPPER; HYDROPHOBIC AND HYDROPHILIC INTERACTIONS; NANOSTRUCTURES; PARTICLE SIZE; SILICON; SURFACE PROPERTIES;

EID: 78651302313     PISSN: 07437463     EISSN: 15205827     Source Type: Journal    
DOI: 10.1021/la1045354     Document Type: Article

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