MDS investigation on the heat transfer properties of CNT micro-channel cooler

Electronics System Integration Technology Conference, ESTC 2010 - Proceedings

Volumn , Issue , 2010, Pages

  Zhang, Yan ^a   Wang, Shun ^a   Fan, Jing Yu ^a   Liu, Johan ^a,b,c  

^a SHANGHAI UNIVERSITY   (China)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^c SHT SMART HIGH TECH AB   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE TRANSFER; DESIGN AND OPTIMIZATION; ELECTRONIC DEVICE; ELECTRONIC PACKAGE; GROWTH PROCESS; HEAT DISSIPATION; HEAT REMOVAL; HEAT TRANSFER PROPERTIES; HIGH TEMPERATURE; HIGH-PERFORMANCE COMPONENTS; HIGH-POWER; INTEGRATED CIRCUIT DEVICES; LIQUID COOLING; MACROSCOPIC EVALUATION; MATERIAL PROPERTY; MICROCHANNEL COOLERS; MOLECULAR DYNAMICS SIMULATIONS; PACKAGING DENSITY; SYSTEM OPERATION; THERMAL EFFICIENCY; THERMAL PERFORMANCE; THERMAL RESISTANCE;

CARBON NANOTUBES; HEAT RESISTANCE; HEAT TRANSFER; MIXED CONVECTION; MOLECULAR DYNAMICS;

COOLING SYSTEMS;

EID: 78651277408     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2010.5642867     Document Type: Conference Paper

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