Development and characterization of microcoolers using carbon nanotubes

ESTC 2006 - 1st Electronics Systemintegration Technology Conference

Volumn 2, Issue , 2006, Pages 881-885

  Wang, Teng ^a   Jönsson, Martin ^b   Nyström, Elisabeth ^a   Mo, Zhimin ^a   Campbell, Eleanor E B ^b   Liu, Johan ^a,c  

^a CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^b UNIVERSITY OF GOTHENBURG   (Sweden)

^c SHANGHAI UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; BONDING; CARBON NANOTUBES; ELECTRONICS PACKAGING; MICROCHANNELS; MICROELECTRONICS;

MICROCHANNEL COOLERS; MICROCOOLERS; PACKAGING DENSITY;

COOLING SYSTEMS;

EID: 42549167934     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2006.280115     Document Type: Conference Paper

References (10)

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