|
Volumn 46, Issue 1, 2011, Pages 94-100
|
Engineered chemistry of Cu-W composites sintered by field-assisted sintering technology for heat sink applications
|
Author keywords
[No Author keywords available]
|
Indexed keywords
COEFFICIENT OF THERMAL EXPANSION;
FIELD-ASSISTED SINTERING;
FINAL DENSITY;
HEAT SINK APPLICATIONS;
HEAT SINK MATERIALS;
HIGH DENSITY;
MICROELECTRONIC COMPONENTS;
POSITIVE EFFECTS;
THERMAL MANAGEMENT SYSTEMS;
FIRE FIGHTING EQUIPMENT;
HEAT SINKS;
MICROELECTRONICS;
ORGANIC POLYMERS;
PRESSURE EFFECTS;
SINTERING;
THERMAL CONDUCTIVITY;
TUNGSTEN;
THERMAL EXPANSION;
|
EID: 78650786193
PISSN: 00222461
EISSN: 15734803
Source Type: Journal
DOI: 10.1007/s10853-010-4842-4 Document Type: Article |
Times cited : (29)
|
References (15)
|