Development of tungsten armor and bonding to copper for plasma-interactive components

Journal of Nuclear Materials

Volumn 258-263, Issue PART 1 A, 1998, Pages 160-172

  Smid, I ^a   Akiba, M ^b   Vieider, G ^c   Plochl L ^d  

^a ARC SEIBERSDORF RESEARCH GMBH   (Austria)

^b JAPAN ATOMIC ENERGY AGENCY   (Japan)

^c MAX PLANCK INSTITUT FÜR PLASMAPHYSIK   (Germany)

^d PLANSEE SE   (Austria)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; COPPER; COPPER ALLOYS; COST EFFECTIVENESS; EXPERIMENTAL REACTORS; FUSION REACTORS; HEAT RESISTANCE; PLASMA SPRAYING; PROTECTIVE COATINGS; SPRAYED COATINGS; TUNGSTEN ALLOYS; VACUUM DEPOSITED COATINGS;

INTERNATIONAL THERMONUCLEAR EXPERIMENTAL REACTORS (ITER); PLASMA-INTERACTIVE COMPONENTS;

TUNGSTEN;

EID: 0032179777     PISSN: 00223115     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0022-3115(98)00358-4     Document Type: Article

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