Study of substrate preheating on flattening behavior of thermal-sprayed copper particles

Journal of Thermal Spray Technology

Volumn 19, Issue 6, 2010, Pages 1195-1205

  Yang, K ^a   Fukumoto, M ^a   Yasui, T ^a   Yamada, M ^a  

^a TOYOHASHI UNIVERSITY OF TECHNOLOGY   (Japan)

Author keywords

adsorbed gas condensation; adsorption desorption; disk shaped splat; duration; flattening; preheating; splash splat; thermal spraying; wetting

Indexed keywords

ADSORBED GAS/CONDENSATION; ADSORPTION/DESORPTION; DISK-SHAPED SPLAT; DURATION; FLATTENING; SPLASH SPLAT;

ADHESION; ADSORPTION; ANGLE MEASUREMENT; BOND STRENGTH (MATERIALS); COATINGS; CONTACT ANGLE; DESORPTION; DISKS (STRUCTURAL COMPONENTS); DROP FORMATION; PREHEATING; SHEAR STRENGTH; THERMAL SPRAYING; WETTING;

SUBSTRATES;

EID: 78650765008     PISSN: 10599630     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11666-010-9515-y     Document Type: Article

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