Effect of substrate temperature and roughness on the solidification of copper plasma sprayed droplets

Materials Science and Engineering: A

Volumn 485, Issue 1-2, 2008, Pages 119-129

  Christoulis, D K ^a,b   Pantelis, D I ^a   De Dave Fabregue N ^b   Borit, F ^b   Guipont, V ^b   Jeandin, M ^b  

^a NATIONAL TECHNICAL UNIVERSITY OF ATHENS   (Greece)

^b CENTRE DES MATÉRIAUX   (France)

Author keywords

Plasma sprayed splat; Solidification; Substrate roughness; Substrate temperature

Indexed keywords

ADHESION; COATING TECHNIQUES; ELECTRON PROBE MICROANALYSIS; MORPHOLOGY; POROSITY; SCANNING ELECTRON MICROSCOPY; SOLIDIFICATION; SURFACE ROUGHNESS; TEMPERATURE;

PLASMA SPRAYED SPLAT; SPLATS MORPHOLOGY;

COPPER;

ADHESION; COATING TECHNIQUES; COPPER; ELECTRON PROBE MICROANALYSIS; MORPHOLOGY; POROSITY; SCANNING ELECTRON MICROSCOPY; SOLIDIFICATION; SURFACE ROUGHNESS; TEMPERATURE;

EID: 42149104963     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2007.07.059     Document Type: Article

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