Nanosized induced low-temperature alloying in binary and ternary noble alloy systems for micro-interconnect applications

Acta Materialia

Volumn 59, Issue 3, 2011, Pages 1184-1190

  Kao, Tzu Hsuan ^a   Song, Jenn Ming ^b   Chen, In Gann ^a   Dong, Teng Yuan ^c   Hwang, Weng Sing ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b NATIONAL DONG HWA UNIVERSITY   (Taiwan)

^c NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

Author keywords

Auger electron microscopy; Depth profiling; Low temperature alloying; Nanoindentation; Nanoparticle deposit

Indexed keywords

AUGER ELECTRON MICROSCOPY; BULK STATE; BULK SUBSTRATES; INTERCONNECT APPLICATIONS; LOW TEMPERATURES; METALLIC NANOPARTICLES; NANO-SIZED; NANOSIZE EFFECTS; NOBLE ALLOYS; NONEQUILIBRIUM CONDITIONS; SUPERCOOLED LIQUIDS; TERNARY ALLOYING;

ALLOYING; AUGER ELECTRON SPECTROSCOPY; AUGERS; DEPOSITS; DEPTH PROFILING; HEATING; NANOINDENTATION; NANOPARTICLES; SILVER; SILVER ALLOYS; SUBSTRATES; SUPERCOOLING;

GOLD;

EID: 78650708684     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2010.10.051     Document Type: Article

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