Interdiffusion behavior at the interfaces between deposits of Au nanoparticles and electronic substrates

Nanotechnology

Volumn 18, Issue 43, 2007, Pages

  Kao, Tzu Hsuan ^a   Song, Jenn Ming ^b   Chen, In Gann ^a   Dong, Teng Yuan ^c   Hwang, Weng Sing ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b NATIONAL DONG HWA UNIVERSITY   (Taiwan)

^c NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

AGGLOMERATION; GOLD COMPOUNDS; INTERFACES (MATERIALS); MELTING POINT; SINTERING; X RAY PHOTOELECTRON SPECTROSCOPY;

DEPOSITED SUSPENSION; ELECTRONIC SUBSTRATES; LIQUID-SOLID REACTIONS; PARTIAL MELTING;

NANOPARTICLES;

ALLOY; COPPER; COPPER DERIVATIVE; GOLD; GOLD DERIVATIVE; NANOPARTICLE; NICKEL; SILVER; THIOL;

ARTICLE; DIFFUSION; ELECTRONICS; ENERGY; LIQUID; MELTING POINT; PARTICLE SIZE; PRIORITY JOURNAL; PROTON NUCLEAR MAGNETIC RESONANCE; SOLID; STOICHIOMETRY; SUSPENSION; THERMAL CONDUCTIVITY; X RAY PHOTOELECTRON SPECTROSCOPY;

EID: 36148930673     PISSN: 09574484     EISSN: 13616528     Source Type: Journal    
DOI: 10.1088/0957-4484/18/43/435708     Document Type: Article

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