A full wafer dicing free dry release process for MEMS devices

Procedia Engineering

Volumn 5, Issue , 2010, Pages 850-853

  Sari, I ^a   Zeimpekis, I ^a   Kraft, M ^a  

^a UNIVERSITY OF SOUTHAMPTON   (United Kingdom)

Author keywords

Accelerometer; Dicing free release; DRIE; Dry release; HF VPE; MEMS; Micro fabrication

Indexed keywords

ACCELEROMETERS; FABRICATION; HYDROFLUORIC ACID; MEMS; SILICON ON INSULATOR TECHNOLOGY;

DICING FREE RELEASE; DRIE; FABRICATION METHOD; LARGE PROOF MASS; PERFORMANCE BENEFITS; RELEASE PROCESS; SILICON ON INSULATOR WAFERS; VAPOUR-PHASE;

SILICON WAFERS;

EID: 78650595101     PISSN: None     EISSN: 18777058     Source Type: Conference Proceeding    
DOI: 10.1016/j.proeng.2010.09.242     Document Type: Conference Paper

References (4)

1. T. Overstolz, P. A. Clerc, W. Noell, M. Zickar, and N. F. de Rooij, "A clean wafer-scale chip-release process without dicing based on vapor phase etching," IEEE MEMS 2004, pp. 717- 720.
2. Y. Matsumoto, M. Nishimura, M. Matsuura, and M. Ishida, "Three-axis SOI capacitive accelerometer with PLL C-V converter", SnA: A, 1999, pp.77-85.
3. Y. Hsu, J. Chen, H. Chien,, S. Chen, S. Lin, and L. Liao "New capacitive low-g triaxial accelerometer with low cross-axis sensitivity", J. Micromech. Microeng. 20 (2010).
4. O. Raccurt, F. Tardif, F.A. d'Avitaya, and T. Vareine, "Influence of liquid surface tension on stiction of SOI MEMS", J. Micromech. Microeng. 14 (2004) 1083-1090.