A clean wafer-scale chip-release process without dicing based on vapor phase etching

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2004, Pages 717-720

  Overstolz, T ^a   Clerc, P A ^a   Noell, W ^a   Zickar, M ^a   De Rooij, N F ^a  

^a UNIVERSITY OF NEUCHÂTEL   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

MICROELECTRONICS; OPTICAL RESONATORS; ORGANIC SOLVENTS; REACTIVE ION ETCHING; SILICON WAFERS; SOLUTIONS; THERMAL EFFECTS; TORSIONAL STRESS;

FRAGILE STRUCTURES; VAPOR PHASE ETCHING (VPE); WAFER-SCALE CHIP-RELEASE PROCESS;

MICROELECTROMECHANICAL DEVICES;

EID: 3042823621     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

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7. T. Overstolz, P.-A. Clerc, M. T. Gale, H. P. Herzig, G. Niederer, W. Noell, J. Söchtig, H. Thiele, N. F. de Rooij, "Tilting Out-Of-Plane Platform For Optical Applications", IEEE/LEOS Optical MEMS Conference 2002, Conference Digest, p. 81-82
8. G. Niederer, H. P. Herzig, M. T. Gale, M. Salt, M. Schnieper, H. Thiele, C. Zschokke, "Resonant Grating Filters at Oblique Incidence", SPIE Proceedings, Vol. 5183-06, 2003