Copper nanowire/polystyrene nanocomposites: Lower percolation threshold and higher EMI shielding

Composites Part A: Applied Science and Manufacturing

Volumn 42, Issue 1, 2011, Pages 92-97

  Al Saleh, Mohammed H ^a,c   Gelves, Genaro A ^a   Sundararaj, Uttandaraman ^a,b  

^a UNIVERSITY OF ALBERTA   (Canada)

^b UNIVERSITY OF CALGARY   (Canada)

^c JORDAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Jordan)

Author keywords

A. Polymer matrix composites (PMCs); B. Electrical properties; B. Microstructures; Metal nanowires

Indexed keywords

B. MICROSTRUCTURES; COMPOSITE PARTS; COMPOSITE POWDERS; COPPER NANOWIRES; DILUTION PROCESS; ELECTRICAL PERCOLATION THRESHOLD; ELECTRICAL PROPERTY; ELECTROMAGNETIC INTERFERENCE; ELECTRON MICROGRAPH; EMI SHIELDING; EMI SHIELDING EFFECTIVENESS; METAL NANOWIRES; PERCOLATION THRESHOLDS; SEGREGATED NETWORK; SHIELDING CAPABILITY; SOLUTION-PROCESSING; X-BAND FREQUENCY RANGE;

COMPRESSION MOLDING; ELECTRIC PROPERTIES; ELECTRIC WIRE; ELECTROMAGNETIC PULSE; ELECTROMAGNETIC SHIELDING; METALLIC MATRIX COMPOSITES; MICROSTRUCTURE; NANOCOMPOSITES; NANOWIRES; PERCOLATION (COMPUTER STORAGE); PERCOLATION (FLUIDS); PERCOLATION (SOLID STATE); POLYSTYRENES; POWDER METALS; RADIATION PROTECTION; SHIELDING; SOLVENTS;

POLYMER MATRIX COMPOSITES;

EID: 78649938057     PISSN: 1359835X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compositesa.2010.10.003     Document Type: Article

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