Parylene-insulated ultradense microfabricated coils

Journal of Microelectromechanical Systems

Volumn 19, Issue 6, 2010, Pages 1277-1283

  Herrault, Florian ^a   Yorish, Svyatoslav ^b   Crittenden, Thomas M ^b   Ji, Chang Hyeon ^a   Allen, Mark G ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b Virtual AeroSurface Technologies   (United States)

Author keywords

Chemical vapor deposition; high aspect ratio; metal microelectromechanical systems (MEMS); microcoils; parylene

Indexed keywords

COMB-LIKE; COPPER WINDINGS; DEPOSITED LAYER; DEVICE INTEGRATION; ELECTRICAL PROPERTY; ELECTRODEPOSITED METALS; HIGH ASPECT RATIO; HIGH FREQUENCY; HIGH PACKING DENSITY; MAGNETIC ACTUATORS; METAL MICROSTRUCTURE; MICROCOILS; MICROCONDUCTORS; MICROFABRICATED; PACKING DENSITY; PARYLENES; SPIRAL WINDING; SUBSTRATE LOSS; TEST STRUCTURE; THREE-LAYER; ULTRADENSE;

CHEMICAL VAPOR DEPOSITION; COMPOSITE MICROMECHANICS; ELECTRIC PROPERTIES; ELECTRODEPOSITION; MECHATRONICS; MEMS; METALS; MICROELECTROMECHANICAL DEVICES; MICROFABRICATION; PHOTORESISTS; THREE DIMENSIONAL; TRANSFORMER WINDINGS; WINDING;

ASPECT RATIO;

EID: 78649674587     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2010.2079914     Document Type: Article

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