The preparation of SnO2 film by electrodeposition

Materials Research Bulletin

Volumn 45, Issue 12, 2010, Pages 2006-2011

  Chen, Xiangping ^a,b   Liang, Jianyu ^b   Zhou, Zhentao ^a   Duan, Huanan ^b   Li, Boquan ^b   Yang, Qiming ^b  

^a SOUTH CHINA UNIVERSITY OF TECHNOLOGY   (China)

^b Worcester Polytechnic Institute   (United States)

Author keywords

A. Inorganic compounds; A. Oxides; A. Thin films; C. X ray diffraction; D. Energy storage

Indexed keywords

A. INORGANIC COMPOUNDS; A. OXIDES; A. THIN FILMS; CATHODIC ELECTRODEPOSITION; CODEPOSITION; CU SUBSTRATE; D. ENERGY STORAGE; ELECTRODEPOSITION TEMPERATURE; ELECTRODEPOSITION VOLTAGE; FINE PARTICLES; POST TREATMENT; PRE-TREATMENT; PROCESSING PARAMETERS;

COPPER; DIFFRACTION; ELECTRODEPOSITION; ELECTROLYTES; ENERGY STORAGE; FLYWHEELS; INORGANIC COMPOUNDS; SUBSTRATES; THIN FILMS; TIN; X RAY DIFFRACTION;

FILM PREPARATION;

EID: 78649322225     PISSN: 00255408     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.materresbull.2010.07.029     Document Type: Article

References (30)

1. C.Y. Kuo, K.H. Huang, and S.Y. Lu Electrochem. Commun. 9 2007 2867
2. S.T. Chang, I.C. Liao, J.H. Yen, and M.H. Hon J. Mater. Chem. 12 2004 1821
3. N. Yang, H.H. Wang, Y.Z. Guo, and X.L. Zhou Rare Metal Mater. Eng. 37 2008 694
4. J.A. Ayllon, and M. Lira-Cantu Appl. Phys. A 95 2009 249
5. T. Zhang, L. Liu, Q. Qi, S. Li, and G. Lu Sens. Actuators B 139 2009 287
6. A. Kowal, S.L. Gojković, K.-S. Lee, P. Olszewski, and Y.-E. Sun Electrochem. Commun. 11 2009 724
7. A. Tischner, T. Maier, C. Stepper, and A. Kock Sens. Actuators B 134 2008 796
8. M.A.L. Pinheiro, T.F. Pineiz, E.A. Morais, L.V.A. Scalvi, M.J. Saeki, and A.A. Cavalheiro Thin Solid Films 517 2008 976
9. J.H. Im, J.H. Lee, and D.W. Park Surf. Coat. Technol. 202 2008 5471
10. L.C. Tien, D.P. Norton, and J.D. Budai Mater. Res. Bull. 44 2009 6
11. S.T. Chang, I.C. Leu, and M.H. Hon Electrochem. Solid-State Lett. 5 2002 C71
12. M. Hyde, A.J. Saterlay, S.K. Wilkins, J.S. Foord, R.G. Campton, and F. Markon J. Solid State Electrochem. 6 2002 183
13. E. Hosono, S. Fujihara, H. Imai, I. Honmaa, and H. Zhou Chem. Commun. 2005 2609
14. S.L. Chou, J.Z. Wang, H.K. Liu, and S.X. Dou Electrochem. Commun. 11 2009 242
15. X.S. Peng, G.S. Wu, P. Holt-Hindle, and A.C. Chen Mater. Lett. 62 2008 1969
16. M.Q. Wu, L.P. Zhang, D.M. Wang, C. Xiao, and S.R. Zhang J. Power Sources 175 2008 669
17. S.T. Chang, I.C. Leu, and M.H. Hon J. Cryst. Growth 273 2004 195
18. S.T. Chang, I.C. Leu, and M.H. Hon J. Alloys Compd. 403 2005 335
19. G.H.A. Therese, and P.V. Kamath Chem. Mater. 12 2000 1195
20. M. Lai, J.A.G. Martinez, M. Grätzel, and D.J. Riley J. Mater. Chem. 16 2006 2843
21. M. Schlesinger, and M. Paunovic Modern Electroplating 4th ed. 2000 Wiley New York
22. C.N. Chang, H.B. Cheng, and A.C. Chao Environ. Sci. Technol. 38 2004 1807
23. D.M. Sherman, K.V. Ragnarsdottir, E.H. Oelkers, and C.R. Collins Chem. Geol. 167 2000 169
24. S.S. Nikulin, I.N. Akatova, and N.A. Kondratéva Russ. J. Appl. Chem. 76 2003 652
25. J.J. Lingane J. Am. Chem. Soc. 67 1945 919
26. A.C.A. de Vooys, R.A. van Santen, and J.A.R. van Veen J. Mol. Catal. A: Chem. 154 2000 203
27. G.E. Dima, A.C.A. de Vooys, and M.T.M. Koper J. Electroanal. Chem. 554-555 2003 15
28. A. Pintar, J. Batista, J. Levee, and T. Kajiuchi Appl. Catal. B 11 1996 81 98
29. I. Langmuir J. Am. Chem. Soc. 38 1916 2221
30. C.-C. Hu, C.-K. Wang, and G.-L. Lee Electrochim. Acta 51 2006 3692