Numerical investigation on the thermal properties of the micro-cooler

Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010

Volumn , Issue , 2010, Pages 634-638

  Liu, Yangming ^a   Zhang, Yan ^a   Wang, Shun ^a   Liu, Johan ^a,b,c  

^a SHANGHAI UNIVERSITY   (China)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^c SHT SMART HIGH TECH AB   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

ALIGNED CARBON NANOTUBES; COMPUTATIONAL FLUID DYNAMICS SIMULATIONS; COOLING EFFECTS; COOLING MEDIUM; FLUID FLOW; FORCED-AIR CONVECTION; GEOMETRICAL PARAMETERS; HEAT DISSIPATION; HEAT REMOVAL; HEAT REMOVAL EFFICIENCY; HEATING POWER; HIGH THERMAL CONDUCTIVITY; IMPINGING JET; LENGTH RATIO; MICRO PIN FINS; MICROCOOLERS; NUMERICAL INVESTIGATIONS; PIN FIN HEAT SINKS; PIN-FINS; POTENTIAL MATERIALS; POWER CHIPS; THERMAL PROPERTIES; TRANSFER PHENOMENON;

CARBON NANOTUBES; COOLING; COOLING SYSTEMS; ELECTRONICS PACKAGING; FINS (HEAT EXCHANGE); FLOW OF FLUIDS; FORCED CONVECTION; MECHANICAL PROPERTIES; PACKAGING; REMOVAL; THERMOANALYSIS; THERMODYNAMIC PROPERTIES;

COMPUTATIONAL FLUID DYNAMICS;

EID: 78449310815     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2010.5583917     Document Type: Conference Paper

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