A heat sink performance study considering material, geometry, nozzle placement, and reynolds number with air impingement

Journal of Electronic Packaging, Transactions of the ASME

Volumn 121, Issue 3, 1999, Pages 156-161

  Maveety, J G ^a   Hendricks, J F ^b  

^a INTEL CORPORATION   (United States)

^b HONEYWELL   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0346392027     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792678     Document Type: Article

References (7)

1. ANSI/ASME PTC 19.1-1985, 1986 “Part 1 Measurement Uncertainty— Instruments and Apparatus,” ASME, New York.
2. Fisher, T. S., Zell, F. A., Sikka, K. K., and Torrance, K. E., 1996, “Efficient Heat Transfer Approximation for the Chip-on-Substrate Problem,” ASME Journal of Electronic Packaging, Vol. 118, pp. 271-279.
3. Ledezma, G., Morega, A. M., and Bejan, A., 1996, “Optimal Spacing Between Pin Fins With Impinging Flow,” ASME Journal Heat Transfer, Vol. 118, pp. 570-577.
4. Nakatogawa, T., Nishiwaki, N., Hirata, M„ and Torii, K„ 1970, “Heat Transfer of Round Turbulent Jet Impinging Normally on a Flat Plate,” Proceedings, Fourth International Heat Transfer Conference, Paris-Versailles, Vol. 2, pp. 1-11.
5. Naraghi, M. H. N., and Antonetti, V. W., 1993, “Macro-Constriction Resistance of Distributed Contact Contour Areas in a Vacuum Environment,” Enhanced Cooling Techniques for Electronic Applications, ASME HTD, Vol. 263, Proceedings of the ASME Winter Annual Meeting, ASME, New York, pp. 107-114.
6. Obot, N. T., Majumdar, A. S., and Douglas, W. J. M., 1979, “The Effect of Nozzle Geometry on Impingement Heat Transfer Under a Round Turbulent Jet,” ASME Paper 79-WA/HT-53.
7. Song, S., Lee, S., and Au, V., 1994, “Closed-Form Equation for Thermal Constriction/Spreading Resistances with Variable Resistance Boundary Condition,” Proceedings, 1994 International Electronics Packaging Conference, Atlanta, GA, pp. 111-121.