Effect of nano-TiO2 addition on wettability and interfacial reactions of Sn0.7Cu composite solder/Cu solder joints

Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010

Volumn , Issue , 2010, Pages 250-253

  Tsao, L C ^a   Wang, B C ^a   Chang, C W ^a   Wu, M W ^b  

^a NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^b NATIONAL FORMOSA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE SOLDERS; CU SUBSTRATE; IMC LAYER; INTERFACIAL MICROSTRUCTURE; INTERFACIAL REACTIONS; NANO-TIO; PROCESSING CONDITION; SEM; SESSILE DROPS; SN-0.7CU SOLDER; SOLDER JOINTS;

INTERMETALLICS; PACKAGING; SCANNING ELECTRON MICROSCOPY; TIN;

CHIP SCALE PACKAGES;

EID: 78449299265     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2010.5582427     Document Type: Conference Paper

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