L-type heat pipes application in electronic cooling system

International Journal of Thermal Sciences

Volumn 50, Issue 1, 2011, Pages 97-105

  Wang, Jung Chang ^a  

^a NATIONAL TAIWAN OCEAN UNIVERSITY   (Taiwan)

Author keywords

Embedded L shaped heat pipes; Superposition method; Thermal performance; Thermal resistance

Indexed keywords

A-THERMAL; COMPUTER AIDED TOOLS; COMPUTER PROGRAM; COOLING ELECTRONIC COMPONENTS; ELECTRONIC COOLING; EMBEDDED L-SHAPED HEAT PIPES; L-SHAPED; PLATE FINS; RAPID DESIGN; SUPERPOSITION METHOD; THERMAL INTERFACES; THERMAL MANAGEMENT; THERMAL PERFORMANCE; THERMAL RESISTANCE;

FINS (HEAT EXCHANGE); FORCED CONVECTION; HEAT PIPES; MATHEMATICAL MODELS; MIXED CONVECTION;

HEAT RESISTANCE;

EID: 78349239267     PISSN: 12900729     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijthermalsci.2010.07.001     Document Type: Article

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