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Volumn 2, Issue , 2000, Pages 340-348
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Solder reflow prediction of hybrid pad packaging system
a
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Author keywords
[No Author keywords available]
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Indexed keywords
ALGORITHMS;
BOUNDARY CONDITIONS;
COMPUTER SIMULATION;
FINITE ELEMENT METHOD;
LAPLACE TRANSFORMS;
NUMERICAL METHODS;
PERTURBATION TECHNIQUES;
SOLDERED JOINTS;
THERMAL LOAD;
THERMODYNAMIC PROPERTIES;
BALL GRID ARRAY;
ENERGY BASED METHOD;
HYBRID PAD PACKAGING SYSTEM;
HYBRID PAD SHAPE;
SINGLE BALL MODULE PREDICTION MODEL;
SOLDER REFLOW PREDICTION;
ELECTRONICS PACKAGING;
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EID: 0033694118
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Article |
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Times cited : (5)
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References (14)
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