SCOPUS 정보 검색 플랫폼

Volumn 45, Issue 24, 2010, Pages 6707-6718

Microstructural stability of copper with antimony dopants at grain boundaries: Experiments and molecular dynamics simulations

(7) Rajgarhia, Rahul K a,d Saxena, Ashok a Spearot, Douglas E a Hartwig, K Ted b More, Karren L c Kenik, Edward A c Meyer, Harry c

a University of Arkansas (United States)

b Department of Electrical and Computer Engineering (United States)

c OAK RIDGE NATIONAL LABORATORY (United States)

d Boston Scientific (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING PROCESS; AVERAGE GRAIN DIAMETER; EQUAL CHANNEL ANGULAR EXTRUSION; GRAIN SIZE; MD SIMULATION; MICROSTRUCTURAL STABILITY; MOLECULAR DYNAMICS SIMULATIONS; NANOCRYSTALLINE CU; ULTIMATE TENSILE STRENGTH;

ALLOYING; ANTIMONY; COMPUTER SIMULATION; COPPER ALLOYS; EXTRUSION; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; MOLECULAR DYNAMICS; TENSILE STRENGTH; TRANSMISSION ELECTRON MICROSCOPY;

NANOCRYSTALLINE ALLOYS;

EID: 78149465198 PISSN: 00222461 EISSN: 15734803 Source Type: Journal
DOI: 10.1007/s10853-010-4764-1 Document Type: Article

Times cited : (30)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.