The formation of stacking fault tetrahedra in Al and Cu: III. Growth by expanding ledges

Acta Materialia

Volumn 59, Issue 1, 2011, Pages 19-29

  Wang, H ^a   Xu, D S ^a   Yang, R ^a   Veyssire, P ^b  

^a INSTITUTE OF METAL RESEARCH   (China)

^b CNRS   (France)

Author keywords

Growth; Ledge mechanism; Molecular dynamics simulations; Shockley dipole; Stacking fault tetrahedron

Indexed keywords

GROWTH; LEDGE MECHANISM; MOLECULAR DYNAMICS SIMULATIONS; SHOCKLEY DIPOLE; STACKING FAULT TETRAHEDRON;

COMPUTATIONAL MECHANICS; DYNAMICS; GEOMETRY; VACANCIES;

MOLECULAR DYNAMICS;

EID: 78049528734     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2010.07.045     Document Type: Article

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