Forty-five degree micromirror fabrication using silicon anisotropic etching with surfactant-added tetramethylammonium hydroxide solution

Japanese Journal of Applied Physics

Volumn 49, Issue 9 PART 1, 2010, Pages

  Yagyu, Hiroyuki ^a   Yamaji, Tadahiro ^a   Nishimura, Makoto ^a   Sato, Kazuo ^b  

^a PANASONIC CORPORATION   (Japan)

^b NAGOYA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ENVIRONMENTAL LOADS; MICRO MIRROR; OPTIMUM CONDITIONS; SILICON ANISOTROPIC ETCHING; TETRAMETHYL AMMONIUM HYDROXIDE; WET ANISOTROPIC ETCHING;

ANISOTROPIC ETCHING; ANISOTROPY; NONIONIC SURFACTANTS; SILICON WAFERS;

SEMICONDUCTING SILICON COMPOUNDS;

EID: 78049364476     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.49.096503     Document Type: Article

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