Conventional printed circuit board technology approach for an electro-optical layer

Japanese Journal of Applied Physics

Volumn 48, Issue 6, 2009, Pages

  Cho, Han Seo ^a   Kim, Sang Hoon ^a   Kim, Joon Sung ^a   Jung, Jaehyun ^a  

^a Samsung Electro Mechanics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRO-OPTICAL; FLEXIBLE COPPER CLAD LAMINATE; LASER MACHINING; LOW COSTS; MIRROR PLANE; MOBILE PHONE APPLICATIONS; OPTICAL INTERCONNECTION MODULE; PRINTED CIRCUIT BOARD TECHNOLOGY; UV EXPOSURE;

ELECTRONICS PACKAGING; INTEGRATED OPTOELECTRONICS; LAMINATES; LIGHT TRANSMISSION; OPTICAL INTERCONNECTS; PRINTED CIRCUIT MANUFACTURE; TELECOMMUNICATION EQUIPMENT;

PRINTED CIRCUIT BOARDS;

EID: 68649105758     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.48.062203     Document Type: Article

References (6)

1. B. S. Rho, W.-J. Lee, J. W. Lim, K. Y. Jung, K. S. Cha, and S. H. Hwang: IEEE Photonics Technol. Lett. 20 (2008) 964.
2. T. Shibata and A. Takahashi: Proc. Electronic Components and Technology Conf., 2008, p. 261.
3. H. S. Cho, K. M. Chu, S. Kang, S. H. Hwang, B. S. Rho, J.-S. Kim, J.-J. Kim, and H.-H. Park: IEEE Trans. Adv. Packag. 28 (2005) 114.
4. E. Bosman, G. Van Steenberge, P. Geerinck, W. Christiaens, J. Vanfleteren, and P. Van Daele: Proc. Electronic Components and Technology Conf., 2007, p. 1281.
5. C.-G. Choi: J. Micromech. Microeng. 14 (2004) 945.
6. M. Fujiwara, Y. Shirato, H. Owari, K. Watanabe, M. Matsuyama, K. Takahama, T. Mori, K. Miyao, K. Choki, T. Fukushima, T. Tanaka, and M. Koyanagi: Jpn. J. Appl. Phys. 46 (2007) 2395.