The embodiment of optical interconnection circuits for the mobile phone application

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6593, Issue , 2007, Pages

  Seo, Ja Won ^a   Seo, Ng Min ^a   Oh, Yun Kyung ^a   Jang, Dong Hoon ^a  

^a SAMSUNG Electronics   (South Korea)

Author keywords

Array; EMI (electro magnetic interference); High data rate and mobile phone; Optical interconnection; Optical transceiver; PD; Serial interface; VCSEL; Waveguide

Indexed keywords

DATA REDUCTION; MOBILE PHONES; SURFACE EMITTING LASERS; TRANSCEIVERS; WAVEGUIDES;

OPTICAL TRANSCEIVERS; SERIAL INTERFACES;

OPTICAL INTERCONNECTS;

EID: 36249006876     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.721910     Document Type: Conference Paper

References (5)

1. MIPI D-PHY Working Group, Draft 0.81 MIPI Alliance Standardfor D-PHY (MIPI, 2006).
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3. Xilinx Inc., http://www.xilinx.com/
4. S. H. Ahn, I. K. Cho, S. P. Han, K. B. Yoon and M. S. Lee, "Optical backplane system using waveguide-embedded PCBs and optical slots" Opt. Eng. 45(8), 085401, August 2006.
5. S. Y. Cho, S. W. Seo, N. M. Jokerst and M. A. Brooke, "Board-Level Optical Interconnection and Signal Distribution Using Embedded Thin-Film Optoelectronic Devices" IEEE Journal of Lightwave Technology, Vol 22, Issue 9, 2111- 2118, Sep. 2004.