Ultrathin (AlCrTaTiZr) Nx /AlCrTaTiZr bilayer structures with high diffusion resistance for Cu interconnects

Journal of the Electrochemical Society

Volumn 157, Issue 6, 2010, Pages

  Chang, Shou Yi ^a   Chen, Dao Sheng ^a  

^a NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHOUS STRUCTURES; BI-LAYER; BI-LAYER STRUCTURE; CU-INTERCONNECTS; DIFFUSION RESISTANCE; INTER-DIFFUSION; INTERFACE ADHESION; METALLIC ELEMENTS; NANO-COMPOSITE STRUCTURE; SILICIDE FORMATION; ULTRA-THIN;

AMORPHOUS FILMS; BUFFER LAYERS; DIFFUSION BARRIERS; METALLIC COMPOUNDS; NANOCOMPOSITES; SILICIDES;

COPPER;

EID: 77958540685     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3374194     Document Type: Article

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