Dielectric frequency response of epoxy-based composites with various silica filler sizes

Proceedings of the 2010 IEEE International Conference on Solid Dielectrics, ICSD 2010

Volumn , Issue , 2010, Pages

  Morshuis, P H F ^a   Andritsch, T ^a   Kochetov, R ^a   Frechette M F ^b   Martinez, H D ^b   Savoie, S ^b   Krivda, A ^c   Smith, L E ^c   Zegarac, D ^c  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b HYDRO QUÉBEC   (Canada)

^c ABB SWITZERLAND LTD   (Switzerland)

Author keywords

Dielectric spectroscopy; Epoxy resin; Heat treatment; Nanocomposites; Silica

Indexed keywords

DIELECTRIC BEHAVIOUR; DIELECTRIC FREQUENCY RESPONSE; MICRO-PHASE; MICROSTRUCTURE ANALYSIS; NANO-PHASE; NANOSIZED SILICA; POST HEAT-TREATMENT; POST TREATMENT; RESEARCH TEAMS; SILICA FILLER; TEM; WEIGHT CONTENT;

DIELECTRIC DEVICES; DIELECTRIC SPECTROSCOPY; EPOXY RESINS; FILLERS; FREQUENCY RESPONSE; HEAT TREATMENT; NANOCOMPOSITES; RESINS; SILICA;

DIELECTRIC MATERIALS;

EID: 77958062034     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICSD.2010.5568094     Document Type: Conference Paper

References (15)

1. C.P. Wong, R.S. Bollampally, "Comparative study of thermally conductive fillers for use in liquid encapsulants for electronic packaging", IEEE Trans. Advanced Packaging, vol. 22, pp. 54-59, 1999.
2. S. Konzelmann, C. Hoffmann, R. Metre, D. Peier, "Thermal and electrical properties of aluminum nitride filled epoxy-resin compound", IEEE Trans. Dielectr. Electr. Insul. vol. 15, pp. 327-333, 2008.
3. M. Fréchette et al., "Nanostructured polymer nanocomposites: a sistinctive class of insulating materials", IEEE Trans. Dielect. Electr. Insul., vol. 15, pp. 90-105, 2005.
4. T. Imai, F. Sawa, T. Ozaki, T. Shimuzu, R. Kido, M. Kozako, T. Tanaka, "Evaluation of insulation properties of epoxy resin with nanoscale silica particles", Proc. ISEIM 2005, pp. 239-242, 2005.
5. T. Imai, F. Sawa, T. Nakano, T. Ozaki, T. Shimizu, S. Kuge, M. Kozako, T. Tanaka, "Insulation properties of nano- and micro-filler mixture composite", IEEE Annual Report CEIDP 2005, pp. 171-174, 2005.
6. T. Imai et al., "Influence of temperature on mechanical and insulation properties of epoxy-layered silicate nanocomposite", IEEE Trans. Dielectr. Electr. Insul., vol. 13, pp. 445-452, 2006.
7. P.O. Henk, T.W. Korsten, T. Kvarts, A. Saeidi, "Increasing the PD-endurance of epoxy and XLPE insulation by nanoparticles silica dispersion in the polymer", Nordic Insulation Symposium, Stockholm, June 11-13, 2001.
8. T. Tanaka, Y. Matsuo, K. Uchida, "Partial discharge endurance of epoxy / SiC nanocomposite", IEEE Annual Report CEIDP 2008, pp. 13-16, 2008.
9. T. Andritsch, R. Kochetov, Y.T. Gebrekiros, U. Lafont, P.H.F. Morshuis, J.J. Smit, "Synthesis and Dielectric Properties of Epoxy based Nanocomposites", IEEE Annual Report CEIDP 2009, pp. 523-526, 2009.
10. P. Preetha, S. Alapati, S. Singha, B. Venkatesulu, M.J. Thomas, "Electrical discharge resistance characteristics of epoxy nanocomposites", IEEE Annual Report CEIDP 2008, pp. 718-721, 2008.
11. H. Li, Z. Zhang, X. Ma, M. Hu, X. Wang, P. Fan, "Synthesis and characterization of epoxy resin modified with nano-SiO2 and γ- glycidoxypropyltrimethoxy silane", Surface & Coating Technology 201, pp. 5269-5272, 2007.
12. R. Kochetov, T. Andritsch, U. Lafont, P.H.F. Morshuis, J.J. Smit, "Thermal conductivity of nano-filled epoxy systems", IEEE Annual Report CEIDP 2009, pp. 658-661, 2009.
13. Y. Sun, Z. Zhang, C.P. Wong, "Influence of interphase and moisture on the dielectric spectroscopy of epoxy/silica composites", Polymer 46, pp. 2297-2305, 2005.
14. C. Zou, J.C. Fothergill, S.W. Rowe, "The effect of water absorption on the dielectric properties of epoxy nanocomposites". IEEE Trans. Dielectr. Electr. Insul., vol.15, pp. 106-117, 2008.
15. G. Schaumburg, "New integrated dielectric analyzer extends accuracy and impedance range for material measurements", Dielectric Newsletter Issue 11, pp. 4-6, May 1999.