Influence of temperature on mechanical and insulation properties of epoxy-layered silicate nanocomposite

IEEE Transactions on Dielectrics and Electrical Insulation

Volumn 13, Issue 2, 2006, Pages 445-452

  Imai, Takahiro ^a,b,c,d   Sawa, Fumio ^a,c   Ozaki, Tamon ^a,c   Shimizu, Toshio ^a,c,d,e   Kido, Ryouichi ^b,c   Kozako, Masahiro ^b,c   Tanaka, Toshikatsu ^{b,c,f,g,h,i,j}  

^a TOSHIBA CORPORATION   (Japan)

^b WASEDA UNIVERSITY   (Japan)

^c Waseda University ^*

^d Society ot Polymer Science Japan (SPSJ)   (Japan)

^e Society of Materials Science   (Japan)

^f New York Academy

^g National Laboratory for High Energy Physics   (Japan)

^h Institute of Cryogenic Society of   (Japan)

ⁱ Research Association of Superconducting Magnetic Energy Storage   (Japan)

^j Society of Energy and Resources

more..

Author keywords

Electrical treeing; Epoxy resin; Internal stress; Mechanical and insulation properties; Nano filler; Nanocomposite

Indexed keywords

ELECTRICAL TREEING; INSULATION BREAKDOWN TIME; MECHANICAL AND INSULATION PROPERTIES; NANO-FILLER;

ELECTRIC BREAKDOWN; ELECTRIC INSULATION; EPOXY RESINS; RESIDUAL STRESSES; THERMAL EFFECTS;

NANOSTRUCTURED MATERIALS;

EID: 33646405504     PISSN: 10709878     EISSN: None     Source Type: Journal    
DOI: 10.1109/TDEI.2006.1624291     Document Type: Article

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