Thermal conductivity of nano-filled epoxy systems

Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP

Volumn , Issue , 2009, Pages 658-661

  Kochetov, R ^a   Andritsch, T ^a   Lafont, U ^a   Morshuis, P H F ^a   Smit, J J ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

BASE MATERIAL; BASE POLYMERS; CABLE TERMINATION; CONCENTRATION OF; EMPIRICAL MODEL; EPOXY RESIN SYSTEM; EPOXY SYSTEMS; FILLER LOADING; HIGH SHEAR; HIGH VOLTAGE TRANSFORMERS; LOW THERMAL CONDUCTIVITY; MORPHOLOGICAL CHARACTERISTIC; NANO-SIZED PARTICLES; NANOSCALE PARTICLES; POWER APPARATUS; SILANE COUPLING AGENT; SURFACE FUNCTIONALIZATION; TRANSMISSION ELECTRON MICROSCOPE; TWO COMPONENT SYSTEMS; ULTRASONIC PROCESSING;

BUILDING MATERIALS; COUPLING AGENTS; ELECTRIC CONNECTORS; ELECTRON MICROSCOPES; FILLERS; INSULATION; NANOPARTICLES; NANOSTRUCTURED MATERIALS; POLYMERS; POWER TRANSFORMERS; RESINS; THERMAL CONDUCTIVITY; THERMOANALYSIS; TRANSMISSION ELECTRON MICROSCOPY; X RAY TUBES;

EPOXY RESINS;

EID: 77949295921     PISSN: 00849162     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/CEIDP.2009.5377801     Document Type: Conference Paper

References (7)

1. W. Kim, J-W. Bae, I-D. Choi, Y-S. Kim, "Thermally Conductive EMC Epoxy Molding Compound) for Microelectronic Encapsulation", Polymer Engineering and Science, Vol. 39, No 4, pp. 756-766, 1999.
2. L. Li and D.D.L. Chung, "Thermally Conducting Polymer-Matrix Composites Containing Both AlN Particles and SiC Whiskers", Journal of Electronic Materials, Vol. 23, No 6, pp. 557-564, 1994.
3. C.P. Wong and R.S. Bollampally, "Comparative Study of Thermally Conductive Fillers for Use in Liquid Encapsulants for Electronic Packaging", IEEE Transactions on Advanced Packaging, Vol. 22, No 1, pp. 54-59, 1999.
4. P. Bowen, J.G. Highfield, A. Mocellin, T.A. Ring, "Degradation of Aluminum Nitride Powder in an Aqueous Environment", J. Am. Ceram. Soc., 73 (3), pp. 724-728, 1990.
5. T. Andritsch, R. Kochetov, Y.T. Gebrekiros, U. Lafont, P.H.F. Morshuis, J.J. Smit, "Synthesis and Dielectric Properties of Epoxy Based Nanocomposites", in press, to be published at CEIDP, Virginia Beach, USA, October 2009.
6. R. Kochetov, T. Andritsch, U. Lafont, P.H.F. Morshuis, S.J. Picken, J.J. Smit, "Thermal Behaviour of Epoxy Resin Filled with High Thermal Conductivity Nanopowders", Electrical Insulation Conference, Montreal, QC, Canada, 31 May - 3 June 2009.
7. S.L. Shindé; J.S. Goela, High Thermal Conductivity Materials, Springer, 2006.