-
4
-
-
41349103471
-
Investigation of the impact of power granularity on chip thermal modeling using white noise analysis
-
K. Etessam-Yazdani, M. Asheghi, and H. Hamann. Investigation of the Impact of Power Granularity on Chip Thermal Modeling Using White Noise Analysis. IEEE Trans on Components and Packaging Technologies, 31(1):211-215, 2008.
-
(2008)
IEEE Trans on Components and Packaging Technologies
, vol.31
, Issue.1
, pp. 211-215
-
-
Etessam-Yazdani, K.1
Asheghi, M.2
Hamann., H.3
-
5
-
-
33846224261
-
Hotspot-limited microprocessors: Direct temperature and power distribution measurements.
-
H. Hamann, A. Weger, J. Lacey, Z. Hu, and P. Bose. Hotspot-Limited Microprocessors: Direct Temperature and Power Distribution Measurements. IEEE Journal of Solid-State Circuits, 42(1):56-65, 2007.
-
(2007)
IEEE Journal of Solid-State Circuits
, vol.42
, Issue.1
, pp. 56-65
-
-
Hamann, H.1
Weger, A.2
Lacey, J.3
Hu, Z.4
Bose., P.5
-
6
-
-
51549099638
-
Many-core design from a thermal perspective
-
W. Huan, M. R. Stan, K. Sankaranarayanan, R. J. Ribando, and K. Skadron. Many-Core Design from a Thermal Perspective. In Design Automation Conference, pages 746-749, 2008.
-
(2008)
Design Automation Conference
, pp. 746-749
-
-
Huan, W.1
Stan, M.R.2
Sankaranarayanan, K.3
Ribando, R.J.4
Skadron, K.5
-
7
-
-
36949023020
-
Live, Runtime phase monitoring and prediction on real systems with application to dynamic power management
-
C. Isci, G. Contreras, and M. Martonosi. Live, Runtime Phase Monitoring and Prediction on Real Systems with Application to Dynamic Power Management. In International Symposium on Microarchitecture, pages 359-370, 2006.
-
(2006)
International Symposium on Microarchitecture
, pp. 359-370
-
-
Isci, C.1
Contreras, G.2
Martonosi, M.3
-
8
-
-
36849089005
-
A self-consistent substrate thermal profile estimation technique for nanoscale ICs - Part I: Electrothermal couplings and full-chip package thermal model
-
DOI 10.1109/TED.2007.909039
-
S. Lin, G. Chrysler, R. Mahajan, V. De, and K. Banerjee. A Self-Consistent Substrate Thermal Profile Estimation Technique for Nanoscale ICs-Part I:Electrothermal Couplings and Full-Chip Package Thermal Model. IEEE Transactions on Electron Devices, 54(12):3342-3350, 2007. (Pubitemid 350225941)
-
(2007)
IEEE Transactions on Electron Devices
, vol.54
, Issue.12
, pp. 3342-3350
-
-
Lin, S.-C.1
Chrysler, G.2
Mahajan, R.3
De, V.K.4
Banerjee, K.5
-
9
-
-
77956195250
-
Measuring performance, power, and temperature from real processors
-
F. J. Mesa-Martinez, M. Brown, J. Nayfach-Battilana, and J. Renau. Measuring Performance, Power, and Temperature from Real Processors. In International Symposium on Computer Architecture, pages 1-10, 2007.
-
(2007)
International Symposium on Computer Architecture
, pp. 1-10
-
-
Mesa-Martinez, F.J.1
Brown, M.2
Nayfach-Battilana, J.3
Renau, J.4
-
10
-
-
33947207004
-
Thermal modeling
-
M. Pedram and S. Nazarin. Thermal Modeling, Analysis, and Management in VLSI circuits: Principles and Methods. Proceedings of the IEEE, 94(8):1487-1501, 2006.
-
(2006)
Analysis, and Management in VLSI Circuits: Principles and Methods. Proceedings of the IEEE
, vol.94
, Issue.8
, pp. 1487-1501
-
-
Pedram, M.1
Nazarin, S.2
-
11
-
-
64949201190
-
CAMP: A Technique to estimate per-structure power at run-time using a few simple parameters
-
M. Powell, A. Biswas, J. Emer, and S. Mukherjee. CAMP: A Technique to Estimate per-Structure Power at Run-Time Using a Few Simple Parameters. International Symposium on High Performance Computer Architecture, pages 289-300, 2009.
-
(2009)
International Symposium on High Performance Computer Architecture
, pp. 289-300
-
-
Powell, M.1
Biswas, A.2
Emer, J.3
Mukherjee, S.4
-
12
-
-
77957935618
-
-
Personal Communication
-
J. Renau. Personal Communication.
-
-
-
Renau, J.1
-
14
-
-
0036954781
-
Modeling and analysis of leakage power considering within-die process variations
-
A. Srivastava, R. Bai, D. Blaauw, and D. Sylvester. Modeling and Analysis of Leakage Power Considering Within-Die Process Variations. In International Symposium on Low Power Electronics and Design, pages 64-67, 2002.
-
(2002)
International Symposium on Low Power Electronics and Design
, pp. 64-67
-
-
Srivastava, A.1
Bai, R.2
Blaauw, D.3
Sylvester, D.4
|