-
1
-
-
0033907557
-
CMOS stress sensors on (100) silicon
-
January
-
Richard C. Jaeger, Jeffrey C. Suhling, Ramanathan Ramani, Arthur T. Bradley, and Jianping Xu, "CMOS Stress Sensors on (100) Silicon," IEEE JOURNAL OF SOLID-STATE CIRCUITS, vol. 35, January 2000.
-
(2000)
IEEE Journal of Solid-State Circuits
, vol.35
-
-
Jaeger, R.C.1
Suhling, J.C.2
Ramani, R.3
Bradley, A.T.4
Xu, J.5
-
2
-
-
0002647466
-
Silicon piezoresistive stress sensors and their application in electronic packaging
-
June
-
Jeffrey C. Suhling and R. C. Jaeger, "Silicon Piezoresistive Stress Sensors and Their Application in Electronic Packaging," IEEE SENSORS JOURNAL, vol. 1, June 2001.
-
(2001)
IEEE Sensors Journal
, vol.1
-
-
Suhling, J.C.1
Jaeger, R.C.2
-
4
-
-
4644250977
-
-
Stuttgart Leibzig Wiesbaden: B. G. Teubner, ISBN 3-519-16256-3, Year
-
Ulrich Mescheder, Mikrosystemtechnik - Konzepte und Anwendungen vol. 2. Stuttgart Leibzig Wiesbaden: B. G. Teubner, ISBN 3-519-16256-3, Year 2004.
-
(2004)
Mikrosystemtechnik - Konzepte und Anwendungen
, vol.2
-
-
Mescheder, U.1
-
5
-
-
36149006772
-
The effect of homogenous mechanical stress on the electrical resistance of crystals
-
P. W. Bridgeman, "The effect of homogenous mechanical stress on the electrical resistance of crystals," Physical Review, Vol. 42, pp. 858-863, 1932.
-
(1932)
Physical Review
, vol.42
, pp. 858-863
-
-
Bridgeman, P.W.1
-
6
-
-
0004172919
-
The effect of pressure on the electrical resistance of certain semiconductors
-
P. W. Bridgeman, "The effect of pressure on the electrical resistance of certain semiconductors," Proc. Amer. Acad. Arts Sci., Vol. 79, pp. 125-179, 1951.
-
(1951)
Proc. Amer. Acad. Arts Sci.
, vol.79
, pp. 125-179
-
-
Bridgeman, P.W.1
-
7
-
-
33846693940
-
Piezoresistance effect in germanium and silicon
-
April
-
Charles S. Smith, "Piezoresistance Effect in Germanium and Silicon," Physical Review, vol. 1, April 1954.
-
(1954)
Physical Review
, vol.1
-
-
Smith, C.S.1
-
8
-
-
0019916789
-
A graphical representation of the piezoresistance coefficients in silicon
-
January
-
Yozo Kanda, "A Graphical Representation of the Piezoresistance Coefficients in Silicon," IEEE TRANSACTIONS ON ELECTRON DEVICES, vol. 29, January 1982.
-
(1982)
IEEE Transactions on Electron Devices
, vol.29
-
-
Kanda, Y.1
-
9
-
-
77957921721
-
-
Graduate Faculty of Auburn University Alabama: Dissertation
-
Yonggang Chen, "CMOS STRESS SENSOR CIRCUITS," Graduate Faculty of Auburn University Alabama: Dissertation, 2006.
-
(2006)
CMOS Stress Sensor Circuits
-
-
Chen, Y.1
-
10
-
-
77957927051
-
Analysis of shift mechanisms in BiCMOS hall devices with scope of a precise SPICE simulation model
-
Dissertation
-
Josef Schweda, "Analysis of Shift Mechanisms in BiCMOS Hall Devices with Scope of a Precise SPICE Simulation Model," Fakultaet fuer Elektrotechnik und Informationstechnik TU Vienna: Dissertation, 2007.
-
(2007)
Fakultaet Fuer Elektrotechnik und Informationstechnik TU Vienna
-
-
Schweda, J.1
-
11
-
-
0029483064
-
Effects of stress-induced mismatches on CMOS analog circuits
-
Richard C. Jaeger, Ramanathan Ramani, Jeffrey C. Suhling, and R. W. Johnson, "Effects of Stress-Induced Mismatches on CMOS Analog Circuits," in VLSI Technology, Systems and Applications, 1995.
-
(1995)
VLSI Technology, Systems and Applications
-
-
Jaeger, R.C.1
Ramani, R.2
Suhling, J.C.3
Johnson, R.W.4
-
14
-
-
77957902152
-
-
Web page
-
ANSYS Inc.: Web page, http://www.ansys.com/.
-
-
-
-
16
-
-
68349139520
-
Design, fabrication, and calibration of piezoresistive stress sensor on SOI wafers for electronic packaging applications
-
June
-
Kuo Tian, Zheyao Wang, Min Zhang, and L. Liu, "Design, Fabrication, and Calibration of Piezoresistive Stress Sensor on SOI Wafers for Electronic Packaging Applications," IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, vol. 32, June 2009.
-
(2009)
IEEE TRANSACTIONS on COMPONENTS and PACKAGING TECHNOLOGIES
, vol.32
-
-
Tian, K.1
Wang, Z.2
Zhang, M.3
Liu, L.4
-
17
-
-
0030714913
-
Stresses from flip-chip assembly and underfill; measurements with the ATC4.1 assembly test chip and analysis by finite element methodt
-
Proc. 47th ECTC
-
David W. Peterson, James N. Sweet, Steven N. Burchett, and A. Hsia, "Stresses From Flip-Chip Assembly and Underfill; Measurements with the ATC4.1 Assembly Test Chip and Analysis by Finite Element Methodt," in Electronic Components and Technology Conference, Proc. 1997 47th ECTC.
-
(1997)
Electronic Components and Technology Conference
-
-
Peterson, D.W.1
Sweet, J.N.2
Burchett, S.N.3
Hsia, A.4
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