Continuous nano/micro-machining and weaving integration process for fiber substrates

Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010

Volumn , Issue , 2010, Pages 320-325

  Itoh, Toshihiro ^a,b   Takamatsu, Seiichi ^a   Kobayashi, Takeshi ^a   Shibayama, Nobuhisa ^b   Miyake, Koji ^a  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

^b BEANS Laboratory   (Japan)

Author keywords

Die coating; Large area electronics; PEDOT: PSS; Pressure sensor; Weaving

Indexed keywords

COATING TECHNOLOGIES; DEVICE FABRICATIONS; ELECTRONIC DEVICE; FABRICATED DEVICE; FIBER SUBSTRATES; HIGH COSTS; HIGH THROUGHPUT; INTEGRATION PROCESS; LARGE-AREA ELECTRONICS; LOW COSTS; MECHANICAL AND ELECTRICAL PROPERTIES; MEMS PROCESS; MEMSDEVICES; METER-SCALE DEVICES; ORGANIC ELECTRONIC MATERIALS; PEDOT:PSS; PLASTIC FIBERS; PRESSURE SENSING; REEL-TO-REEL PROCESS;

CHIP SCALE PACKAGES; DIES; ELECTRIC PROPERTIES; FABRICATION; FIBERS; MECHANICAL PROPERTIES; PLASTIC COATINGS; PRESSURE SENSORS; SENSOR ARRAYS; SPINNING (FIBERS); WEAVING;

ELECTRON DEVICES;

EID: 77957852522     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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