Processing and quantitative analysis of biodegradable polymers (PLLA and PCL) thermal bonding

Journal of Micromechanics and Microengineering

Volumn 20, Issue 8, 2010, Pages

  Boutry, C M ^a   Kiran, R ^a   Umbrecht, F ^a,b   Hierold, C ^a  

^a ETH ZURICH   (Switzerland)

^b CEA LIST   (France)

Author keywords

[No Author keywords available]

Indexed keywords

BOND STRENGTH; BONDING PARAMETERS; CAPROLACTONE; CRYSTALLINITIES; FABRICATION PROCESS; MELTING TEMPERATURES; PACKAGING APPLICATIONS; PLLA; POLY-L-LACTIDE; QUANTITATIVE ANALYSIS; RESPONSE SURFACE METHODOLOGY; SURFACE PLOTS; THERMAL BONDING; WEIGHT-AVERAGE MOLECULAR WEIGHT;

ASPECT RATIO; BIODEGRADABLE POLYMERS; BOND STRENGTH (MATERIALS); CHEMICAL PROPERTIES; CHROMATOGRAPHIC ANALYSIS; COMPRESSION MOLDING; CONDUCTIVE MATERIALS; DIFFERENTIAL SCANNING CALORIMETRY; FABRICATION; MICROCHANNELS; ORGANIC POLYMERS; PACKAGING MATERIALS;

BONDING;

EID: 77957831358     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/20/8/085006     Document Type: Article

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