Quantitative analysis of biodegradable polymers (PLLA & PCL) thermal bonding

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2010, Pages 404-407

  Boutry, C M ^a   Kiran, R ^a   Umbrecht, F ^a   Hierold, C ^a  

^a ETH ZURICH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

BOND STRENGTH; BONDING PARAMETERS; CAPROLACTONE; PACKAGING APPLICATIONS; PLLA; POLY-L-LACTIDE; QUANTITATIVE ANALYSIS; RESPONSE SURFACE METHODOLOGY; SURFACE PLOTS; THERMAL BONDING;

ASPECT RATIO; BIODEGRADABLE POLYMERS; MECHANICAL ENGINEERING; MECHANICS; ORGANIC POLYMERS; REACTIVE ION ETCHING;

BOND STRENGTH (MATERIALS);

EID: 77952761287     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2010.5442481     Document Type: Conference Paper

References (8)

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