Nonlinear compact thermal model of power semiconductor devices

IEEE Transactions on Components and Packaging Technologies

Volumn 33, Issue 3, 2010, Pages 643-647

  Górecki, Krzysztof ^a   Zarebski, Janusz ^a  

^a GDYNIA MARITIME UNIVERSITY   (Poland)

Author keywords

Compact thermal model; power semiconductor devices; self heating

Indexed keywords

ANALYTICAL DESCRIPTION; COMPACT THERMAL MODELS; COOLING CONDITIONS; MODEL PARAMETER ESTIMATION; POWER SEMICONDUCTOR DEVICES; POWER TRANSISTORS; SELECTED METALS; SELF-HEATING;

HEATING; MOS DEVICES; PARAMETER ESTIMATION; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR SWITCHES; THERMOGRAPHY (TEMPERATURE MEASUREMENT);

POWER ELECTRONICS;

EID: 77957760364     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2010.2052052     Document Type: Article

References (30)

1. W. Janke, Zjawiska Termiczne w Elementach i Układach Półprzewodni-Kowych (in Polish). Warszawa, Poland: WNT, 1992.
2. Z. Lisik, Zjawiska w Strukturach Półprzewodnikowych: Metody Ich Modelowania (in Polish). Łódź, Poland: Wydawnictwo Politechniki Łódzkiej, 2005.
3. J. Zarȩbski, Tranzystory MOS Mocy (in Polish). Gdynia, Poland: Fundacja Rozwoju Akademii Morskiej w Gdyni, 2007.
4. J. Zarȩbski, Modelowanie, Symulacja i Pomiary Przebiegów Elektrotermicznych w Elementach Półprzewodnikowych i Układach Elektronicznych (in Polish). Gdynia, Poland: Prace Naukowe Wyz̀szej Szkoły Morskiej w Gdyni, 1996.
5. W. Wójciak, M. Orlikowski, M. Zubert, and A. Napieralski, "The design of electro-thermal modeling of microdevices in CMOS compatible MEMS technology", in Proc. Int. Workshop Thermal Investigat. ICs Microstruct. Therminic, 1997, pp. 34-36.
6. A. Napieralski, and M. Grecki, "2-D simulation of semiconductor devices with temperature computation inside the silicon structure", in Proc. Electromagn. Phenom. Nonlinear Circuits, 1994, pp. 195-200.
7. V. Székely, "A new evaluation method of thermal transient measurement results", Microelectron. J., vol. 28, no. 3, pp. 277-292, 1997.
8. V. Székely, "Identification of RC networks by deconvolution: Chances and limits", IEEE Trans. Circuits Syst. I: Theory Applicat., vol. 45, no. 3, pp. 244-258, Mar. 1998.
9. K. Nemeth, "On the analysis of nonlinear resistive networks considering the effect of temperature", IEEE J. Solid-State Circuits, vol. 11, no. 4, pp. 550-552, Aug. 1976.
10. D. L. Blackburn and F. F. Oettinger, "Transient thermal response measurements of power transistors", IEEE Trans. Ind. Electron. Control Instrum., vol. 22, no. 2, pp. 134-141, May 1975.
11. A. R. Hefner and D. L. Blackburn, "Simulating the dynamic electrothermal behavior of power electronic circuits and systems", IEEE Trans. Power Electron., vol. 8, no. 4, pp. 376-385, Oct. 1993.
12. J. Zarȩbski and K. Górecki, "Modeling CoolMOS transistors in SPICE", IEE Proc. Circuits Devices and Syst., vol. 153, no. 1, pp. 46-52, 2006.
13. M. Rencz and V. Szekely, "Dynamic thermal multiport modeling of IC packages", IEEE Trans. Compon. Packag. Technol., vol. 24, no. 4, pp. 596-604, Dec. 2001.
14. M. Rencz, V. Szekely, and A. Poppe, "Integration of a network solver and a field solver for the mixed level thermal simulation of MEMS problems", in Proc. SPIE, vol. 4755. 2002, pp. 36-43.
15. J. Zarȩbski, "The time dependence calculations of the junction temperature of semiconductor devices", Int. J. Microcomput. Applicat., vol. 13, no. 2, pp. 62-70, 1994.
16. J. Zarȩbski and K. Górecki, "Properties of some convolution algorithms for the thermal analysis of semiconductor devices", Appl. Math. Model., vol. 31, no. 8, pp. 1489-1496, 2007.
17. P. E. Bagnoli, C. Casarosa, M. Ciampi, and E. Dallago, "Thermal resistance analysis by induced transient (TRAIT) method for power electronic devices thermal characterization. I: Fundamentals and theory", IEEE Trans. Power Electron., vol. 13, no. 6, pp. 1208-1219, Nov. 1998. (Pubitemid 128742372)
18. F. N. Masana, "Pseudo-3-D dynamic thermal model for semiconductor packages", in Proc. 7th Int. Conf. Mixed Design Integr. Circuits Syst. MIXDES, 2000, pp. 357-360.
19. K. Górecki and J. Zarȩbski, "Parameters estimation of thermal model of semiconductor devices", Kwartalnik Elektroniki i Telekomunikacji (in Polish), vol. 52, no. 3, pp. 347-360, 2006.
20. K. Górecki, J. Zarȩbski, and W. J. Stepowicz, "The influence of selected factors on the thermal parameters of semiconductor devices", Elektronika (in Polish), vol. 46, no. 10, pp. 18-20, 2005.
21. K. Górecki and J. Zarȩbski, "Microcomputer system for measuring thermal parameters of a class of semiconductor devices and integrated circuits", Metrol. Measure. Syst. (in Polish), vol. VIII, no. 4, pp. 379-396, 2001.
22. K. Górecki and J. Zarȩbski, "Investigations of power MOSFETs transient thermal impedance", in Proc. EDPE, vol. E05-75. 2005, p. 84.
23. J. Zarȩbski and K. Górecki, "A method of measuring the transient thermal impedance of monolithic bipolar switched regulators", IEEE Trans. Compon. Packag. Technol., vol. 30, no. 4, pp. 627-631, Dec. 2007.
24. J. Zarȩbski and K. Górecki, "A method of the thermal resistance measurements of semiconductor devices with P-N Junction", Measurement, vol. 41, no. 3, pp. 259-265, 2008.
25. F. Incropera and D. De Witt, Fundamental of Heat and Mass Transfer. New York: Wiley, 1996.
26. M. Kamiński, M. Janicki, and A. Napieralski, "Application of RC equivalent networks to modeling of nonlinear thermal phenomena", Elektronika, vol. 48, no. 10, pp. 7-12, 2007.
27. M. Rencz and V. Szekely, "Studies on the nonlinearity effects in dynamic compact model generation of packages", IEEE Trans. Compon. Packag. Technol., vol. 27, no. 1, pp. 124-130, Mar. 2004.
28. W. Janke and A. Hapka, "Nonlinear thermal characteristics of silicon carbide devices", in Proc. 8th Int. Conf. Microtechnol. Thermal Problems Electron., 2009, pp. 145-150.
29. K. Górecki and J. Zarȩbski, "The nonlinear compact thermal model of power MOS transistors", in Proc. 20th ICM, 2008, pp. 171-174.
30. F. H. Reynolds, "Measuring and modeling integrated circuit failure rates", in Eurocon'82, Copenhagen: Reliability in Electrical and Electronic Components and Systems, vol. 1. Amsterdam, the Netherlands: North Holland, 1982, pp. 36-45.