Application of silver nanoparticles to improve wettability of SnAgCu solder paste

ISSE 2010 - 33rd International Spring Seminar on Electronics Technology: Polymer Electronics and Nanotechnologies: Towards System Integration - Conference Proceedings

Volumn , Issue , 2010, Pages 473-477

  Kościelski, Marek ^a   Bukat, Krystyna ^a   Jakubowska, Małgorzata ^b   Młozniak, Anna ^c  

^a TELE AND RADIO RESEARCH INSTITUTE   (Poland)

^b WARSAW UNIVERSITY OF TECHNOLOGY   (Poland)

^c ukasiewicz Research Network Institute of Microelectronics and Photonics   (Poland)

Author keywords

[No Author keywords available]

Indexed keywords

COMMONLY USED; COPPER SUBSTRATES; DIFFERENT THICKNESS; ELECTRONICS ASSEMBLY; EUROPEAN REGULATION; GRAIN SIZE; LEAD-FREE SOLDER PASTE; MATERIAL PROPERTY; NANO SILVER; PRINTED WIRING BOARDS; REFLOW PROCESS; RESEARCH OBJECTIVES; SAC-SOLDERS; SEM; SILVER NANOPARTICLES; SNAGCU ALLOYS; SNAGCU SOLDER; SOLDER JOINTS; SOLDER PASTE;

GRAIN SIZE AND SHAPE; LAWS AND LEGISLATION; NANOPARTICLES; NANOTECHNOLOGY; PRINTED CIRCUIT BOARDS; SILVER ALLOYS; SOLDERING; SURFACE MOUNT TECHNOLOGY; TECHNICAL PRESENTATIONS;

SILVER;

EID: 77956967623     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSE.2010.5547345     Document Type: Conference Paper

References (10)

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