Hybrid integration of a low-voltage, high-current power supply buck converter with an LTCC substrate inductor

IEEE Transactions on Power Electronics

Volumn 25, Issue 9, 2010, Pages 2287-2298

  Lim, Michele Hui Fern ^a,b   Van Wyk, Jacobus Daniel ^c   Lee, Fred C ^a  

^a Virginia Polytechnic Institute and State University   (United States)

^b NATIONAL SEMICONDUCTOR CORPORATION   (United States)

^c UNIVERSITY OF JOHANNESBURG   (South Africa)

Author keywords

Hybrid integration; low temperature cofired ceramic (LTCC) technology; magnetic shielding; magnetic substrates; mobile power supplies; planar integration

Indexed keywords

HYBRID INTEGRATION; LOW-TEMPERATURE CO-FIRED CERAMICS; MAGNETIC SUBSTRATE; MOBILE POWER SUPPLIES; PLANAR INTEGRATION;

CERAMIC MATERIALS; DC-DC CONVERTERS; ELECTRIC INDUCTORS; INDUCTANCE; INTEGRATION; MAGNETISM; OVERCURRENT PROTECTION; SUBSTRATES; TECHNOLOGY;

MAGNETIC SHIELDING;

EID: 77956926872     PISSN: 08858993     EISSN: None     Source Type: Journal    
DOI: 10.1109/TPEL.2010.2046913     Document Type: Article

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