Investigation on the effect of copper leadframe oxidation on package delamination

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1995, Pages 463-469

  Chong, Chai Tai ^a   Leslie, Alan ^a   Beng, Lim Thiam ^a   Lee, Charles ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

BOND STRENGTH (MATERIALS); COPPER OXIDES; DELAMINATION; FAILURE (MECHANICAL); INTEGRATED CIRCUITS; INTERFACES (MATERIALS); OXIDATION; SCANNING ELECTRON MICROSCOPY; SECONDARY ION MASS SPECTROMETRY; THICKNESS CONTROL; X RAY PHOTOELECTRON SPECTROSCOPY;

COPPER LEADFRAME OXIDATION; DIE PAD/COMPOUND INTERFACE;

ELECTRONICS PACKAGING;

EID: 0029218765     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)