Role of surface morphology on interfacial adhesion in IC packaging

Proceedings of the Electronic Technology Conference, EPTC

Volumn , Issue , 1997, Pages 201-207

  Lee, Charles ^a   Rasiah, Ignatius ^a   Chong, Chai Tai ^a   Gopalakrishnan, R ^a  

^a Siemens Components Pte Ltd   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; INTEGRATED CIRCUIT MANUFACTURE; INTERFACES (MATERIALS); MORPHOLOGY; SHEET MOLDING COMPOUNDS; SURFACE ROUGHNESS; WETTING;

LEADFRAME; POWER SPECTRAL DENSITY FUNCTIONS;

ELECTRONICS PACKAGING;

EID: 0031323702     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (33)