Machining performance of Ti-Al-Si-N coated inserts

Surface and Coatings Technology

Volumn 205, Issue 2, 2010, Pages 582-586

  Chen, Li ^a,b   Wang, She Q ^a,b   Du, Yong ^a   Zhou, Shu Z ^b   Gang, Tie ^c   Fen, Ji C ^c   Chang, Ke K ^a   Li, Yi W ^a   Xiong, Xiang ^a  

^a CENTRAL SOUTH UNIVERSITY   (China)

^b Zhuzhou Cemented Carbide Cutting Tools Co Ltd   (China)

^c HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Adhesive strength; Hardness; Machining performance; Multilayer; Ti Al Si N coating

Indexed keywords

ADHESIVE STRENGTH; BI-LAYER; CATHODIC ARC EVAPORATION; CEMENTED CARBIDE SUBSTRATES; COHESIVE STRENGTH; COMPARATIVE RESEARCH; HIGH HARDNESS; LIFE-TIMES; MACHINING PERFORMANCE; MULTI-LAYER-COATING; QUATERNARY COATINGS; SINGLE LAYER; STRUCTURE DESIGN; THERMAL STABILITY; TI-AL-N; TIALSIN;

CARBIDES; COATINGS; HARDNESS; INDUSTRIAL APPLICATIONS; MILLING (MACHINING); MULTILAYERS; NANOCOMPOSITES; OPTIMIZATION; SILICON; SUBSTRATES;

ALUMINUM;

EID: 77956434790     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2010.07.043     Document Type: Article

References (24)

1. PalDey S., Deevi S.C. Mater. Sci. Eng. A 2003, 342:58.
2. Fox-Rabinovich G.S., Kovalev A.I., Aguirre M.H., Beake B.D., Yamamoto K., Veldhuis S.C., Endrino J.L., Rashkovskiy A.Y. Surf. Coat. Technol. 2009, 204(4):489.
3. Moser M., Mayrhofer P.H., Székely L., Sáfrán G., Barna P.B. Surf. Coat. Technol. 2008, 203:148.
4. Soldán J., Neidhardt J., Sartory B., Kaindl R., Čerstvỳ R., Mayrhofer P.H., Tessadri R., Polcik P., Lechthaler M., Mitterer C. Surf. Coat. Technol. 2008, 202:3555.
5. Rovere F., Mayrhofer P.H., Reinholdt A., Mayer J., Schneider J.M. Surf. Coat. Technol. 2008, 202:5870.
6. Kutschej K., Mayrhofer P.H., Kathrein M., Polcik P., Mitterer C. Surf. Coat. Technol. 2005, 200:1731.
7. Veprek S., Mönnling H.-D., Jilek M., Holubar P. Mater. Sci. Eng. A 2004, 366:202.
8. Carvalho S., Rebouta L., Cavaleiro A., Rocha L.A., Gomes J., Alves E. Thin Solid Films 2001, 398-399:391.
9. Cairney J.M., Hoffman M.J., Munroe P.R., Martin P.J., endavid A.B. Thin Solid Films 2005, 479:193.
10. Rafaja D., Poklad A., Klemm V., Schreiber G., Heger D., Šíma M. Mater. Sci. Eng. A 2007, 462:279.
11. Veprek S., Jilek M. Vacuum 2002, 67:443.
12. Chen L., Du Y., Wang A.J., Wang S.Q., Zhou S.Z. Int. J. Refract. Met. Hard Mater. 2009, 27:718.
13. Chen L., Du Y., Wang S.Q., Wang A.J., Xu H.H. Mater. Sci. Eng. A 2009, 502:139.
14. Powder diffraction file (Card 38-1420 for c-TiN, Card 25-1495 for c-AlN, Card 15-0806 for c-Co, Card 05-0727 for h-Co, card 51-0939 for WC).
15. Oliver W.C., Pharr G.M. J. Mater. Res. 1992, 7:1564.
16. Chen L., Du Y., Wang S.Q., Li J. Int. J. Refract. Met. Hard Mater. 2007, 25:400.
17. Zhang R.F., Veprek S. Thin Solid Films 2008, 516:2264.
18. Chen L., Wang S.Q., Du Y., Li J. Mater. Sci. Eng. A 2008, 478:336.
19. Chen Li., Yong Du., Yin Fei, Li Jia J. Refract. Met. Hard Mater. 2007, 25:72.
20. Yang S.C., Wiemann E., Teer D.G. Surf. Coat. Technol. 2004, 188-189:662.
21. Niederhofer A., Bolom T., Nesladek P., Moto K., Eggs C., Patil D.S. Surf. Coat. Technol. 2001, 146-147:183.
22. Koch C.C. J. Mater. Sci. 2007, 42:1403.
23. Maryhofer P.H., Horling A., Karlsson L., Sjolen J., Larsson T., Mitterer C., Hultman L. Appl. Phys. Lett. 2003, 83:2049.
24. Chen Li., Du Y., Mayrhofer P.H., Wang S.Q., Li J. Surf. Coat. Technol. 2008, 202:5185.