SCOPUS 정보 검색 플랫폼

Microfluidics and Nanofluidics

Volumn 9, Issue 2-3, 2010, Pages 243-252

Low frequency induction heating for the sealing of plastic microfluidic systems

(4) Knauf, Benedikt J a Webb, D Patrick a Liu, Changqing a Conway, Paul P a

a LOUGHBOROUGH UNIVERSITY (United Kingdom)

Author keywords

Induction heating; Microfluidic systems; Plastic bonding

Indexed keywords

AIR-PRESSURE; ANALYTICAL APPROACH; BOND STRENGTH; BONDING PROCESS; DESIGN RULES; HEAT DISSIPATION; LOW FREQUENCY INDUCTION; MARKET NEEDS; MICRO FLUIDIC SYSTEM; MICROFLUIDIC CHANNEL; MICROFLUIDIC PLATFORMS; MICROFLUIDIC SYSTEMS; PLASTIC BONDING; POLYMER MICROFLUIDICS; PROCESS OPTIMISATION; PRODUCTION METHODS; RAPID METHOD;

BONDING; FLUIDIC DEVICES; HEATING; INDUCTION HEATING; PLASTICS;

MICROFLUIDICS;

EID: 77956266364 PISSN: 16134982 EISSN: 16134990 Source Type: Journal
DOI: 10.1007/s10404-009-0539-x Document Type: Article

Times cited : (20)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.