Plastic packaging using low frequency induction heating (LFIH) for microsystems

10th Electronics Packaging Technology Conference, EPTC 2008

Volumn , Issue , 2008, Pages 172-180

  Knauf, Benedikt J ^a   Webb, D Patrick ^a   Liu, Changqing ^a   Conway, Paul P ^a  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FLUIDIC DEVICES; HEATING; INDUCTION HEATING;

BONDING PROCESS; HEAT DISSIPATIONS; LOW FREQUENCY INDUCTIONS; METAL FEATURES; MICRO FLUIDIC SYSTEMS; MICROFLUIDIC PLATFORMS; PLASTIC PACKAGING; POLYMER BASED; RAPID METHODS; SUSCEPTORS; THIN METAL LAYERS; WORK PIECES;

POLYMER MELTS;

EID: 63049117156     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2008.4763430     Document Type: Conference Paper

References (6)

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5. Y. Peles, V. T. Srikar, T. S. Harrison, C. Protz, A. Mracek and S. M. Spearing, "Fluidic packaging of microengine and microrocket devices for high-pressure and high-temperature operation," Microelectromechanical Systems, Journal of, vol. 13, pp. 31-40, 2004.
6. C. H. Lin, G. B. Lee, L. M. Fu and S. H. Chen, "Integrated optical-fiber capillary electrophoresis microchips with novel spin-on-glass surface modification," Biosensors and Bioelectronics, vol. 20, pp. 83-90, 07/04. 2004.