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Volumn , Issue , 2008, Pages
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Packaging of polymer based microfluidic systems using low frequency induction heating (LFIH)
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Author keywords
[No Author keywords available]
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Indexed keywords
ELECTRONICS PACKAGING;
FLUIDIC DEVICES;
HEATING;
INDUCTION HEATING;
METALS;
NANOFLUIDICS;
POLYMERS;
TECHNOLOGY;
BONDING PROCESSES;
ELECTRONIC PACKAGING;
HIGH-DENSITY PACKAGING;
INTERNATIONAL CONFERENCES;
LOW FREQUENCY INDUCTION;
METAL FEATURES;
MICRO FLUIDIC SYSTEMS;
MICROFLUIDIC PLATFORMS;
POLYMER BASED;
RAPID METHODS;
SUSCEPTORS;
THIN METAL LAYERS;
POLYMER MELTS;
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EID: 52449109481
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ICEPT.2008.4606943 Document Type: Conference Paper |
Times cited : (5)
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References (6)
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