Grain coarsening mechanism of Cu thin films by rapid annealing

Thin Solid Films

Volumn 518, Issue 23, 2010, Pages 6883-6890

  Sasajima, Yasushi ^a   Kageyama, Junpei ^a   Khoo, Khyoupin ^a   Onuki, Jin ^a  

^a IBARAKI UNIVERSITY   (Japan)

Author keywords

Copper thin films; Electron backscattering analysis; Grain growth; Phase field method; Rapid thermal annealing; Simulation

Indexed keywords

BACKSCATTERING; COPPER COMPOUNDS; ELECTROLYTES; ELECTRON SCATTERING; INFRARED LAMPS; ISOTHERMAL ANNEALING; ISOTHERMS; PHASE TRANSITIONS; POLYCRYSTALLINE MATERIALS; RAPID THERMAL ANNEALING; THIN FILMS;

AFTER-HEAT TREATMENT; AVERAGE GRAIN DIAMETER; COPPER THIN FILM; ELECTRON BACKSCATTERING; ELECTRON BACKSCATTERING PATTERN ANALYSIS; GRAIN GROWTH MODELING; PHASE FIELD METHODS; SIMULATION;

GRAIN GROWTH;

EID: 77956226147     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2010.07.039     Document Type: Article

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