Preparation technique for copper-plating on Si nanoporous pillar array

Thin Solid Films

Volumn 518, Issue 23, 2010, Pages 6866-6869

  Yang, Xiao Hui ^a   Jiang, Wei Fen ^a   Li, Xin Jian ^b  

^a North China University of Water Conversancy and Hydroelectric Power   (China)

^b ZHENGZHOU UNIVERSITY   (China)

Author keywords

Crater like structures; Cu Si NPA; Hydrothermal etching; Immersion plating; Silicon nanoporous pillar arrays (Si NPA)

Indexed keywords

CRATER-LIKE STRUCTURES; CU/SI-NPA; HYDROTHERMAL ETCHING; IMMERSION PLATING; SILICON NANOPOROUS PILLAR ARRAYS (SI-NPA);

DEPOSITION; ETCHING; FILM PREPARATION; NANOCOMPOSITES; PLATING;

SILICON;

EID: 77956225065     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2010.07.019     Document Type: Article

References (15)

1. L.T. Canham Appl. Phys. Lett. 57 1990 1046
2. S. Ottow, V. Lehmann, and H. Foll J. Electrochem. Soc. 143 1996 385
3. B. Unal, A.N. Parbukov, and S.C. Bayliss Opt. Mater. 17 2001 79
4. M.A. Rocchia, E. Garrone, F. Geobaldo, L. Boarino, and M.J. Sailor Phys. Status Solidi A 197 2003 365
5. Su. Xu, Kangle Lv, Yanlong Chang, Yan Zhang, and Chunming Wang Chin. J. Chem. 27 2009 1682
6. F.A. Harraz, T. Sakka, and Y.H. Ogata Electrochim. Acta 47 2002 1249
7. B.D. Yao, and N. Wang J. Phys. Chem. B 105 2001 11395
8. Pushperdra Kumar, and Patrick Huber J. Phys. D Appl. Phys. 40 2007 2864
9. Kui qing Peng, and Jing Zhu J. Electroanal. Chem. 558 2003 35
10. T. Qiu, X.L. Wu, and Y.F. Mei J. Cryst. Growth 277 2005 143
11. F.A. Harraz, and T. Sakka Electrochim. Acta 46 2001 2805
12. J. Sasano, R. Murota, Y. Yamauchi, T. Sakka, and Y.H. Ogata J. Electroanal. Chem. 559 2003 125
13. Didier Hamm, Tetsuo Sakka, and Yukio H. Ogata Electrochim. Acta 49 2004 4949
14. Lu. Guojin, and Giovanni Zangari Electrochim. Acta 51 2006 2531
15. A.G. Muñoz, and H.J. Lewerenz J. Electrochem. Soc. 156 2009 184