Kinetics of corrosion film growth on copper in neutral chloride solutions containing small concentrations of sulfide

Journal of the Electrochemical Society

Volumn 157, Issue 10, 2010, Pages

  Chen, J ^a   Qin, Z ^a   Shoesmith, D W ^a  

^a UNIVERSITY OF WESTERN ONTARIO   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

CHLORIDE SOLUTIONS; COHERENT LAYER; CORROSION BEHAVIOR; CORROSION FILM; CRYSTALLINE LAYERS; DIFFUSION PROCESS; ION DIFFUSION; MICRO X RAY DIFFRACTION; NON-UNIFORM THICKNESS; OXYGEN FREE COPPER; PARABOLIC LAW; SMALL CONCENTRATION;

COPPER; DIFFUSION; ELECTROCHEMICAL CORROSION; ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY; GROWTH KINETICS; OXYGEN; SCANNING ELECTRON MICROSCOPY; SODIUM CHLORIDE; X RAY DIFFRACTION; X RAY PHOTOELECTRON SPECTROSCOPY;

FILM GROWTH;

EID: 77956217274     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3478570     Document Type: Article

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