Sulfide film formation on copper under electrochemical and natural corrosion conditions

Corrosion

Volumn 63, Issue 2, 2007, Pages 135-144

  Smith, J ^a   Qin, Z ^a   King, F ^b   Werme, L ^c   Shoesmith, D W ^a  

^a UNIVERSITY OF WESTERN ONTARIO   (Canada)

^b INTEGRITY CORROSION CONSULTING LTD   (Canada)

^c SWEDISH NUCLEAR FUEL AND WASTE MANAGEMENT CO   (Sweden)

Author keywords

Copper; Corrosion potential; Electrochemical impedance spectroscopy; High level waste; Mechanism; Sulfide voltammetry

Indexed keywords

CORROSION RATE; ELECTROCHEMICAL CORROSION; FILM GROWTH; SULFIDE CORROSION CRACKING; THERMODYNAMIC STABILITY;

CHALCOCITE; CORROSION POTENTIAL; SULFIDE VOLTAMMETRY;

COPPER CORROSION;

COPPER CORROSION; CORROSION RATE; ELECTROCHEMICAL CORROSION; FILM GROWTH; SULFIDE CORROSION CRACKING; THERMODYNAMIC STABILITY;

EID: 34248383933     PISSN: 00109312     EISSN: None     Source Type: Journal    
DOI: 10.5006/1.3278338     Document Type: Article

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